ELECTROMAGNETIC WAVE SHIELD FILM, PRINTED WIRING BOARD USING SAME, AND ROLLED COPPER FOIL
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United States of America Patent
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Issued Date -
Apr 28, 2016
app pub date -
Apr 30, 2014
filing date -
May 29, 2013
priority date (Note) -
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Abstract
An electromagnetic wave shield film in which peeling off between a metal thin film and an adhesive layer is prevented and a printed wiring board employing the electromagnetic wave shield are provided. An electromagnetic wave shield film is formed by laminating at least a metal thin film and an adhesive layer in order, and the water vapor permeability of the electromagnetic wave shield film according to JISK7129 is 0.5 g/m2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a pressure difference of 1 atm.
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