APPARATUS AND METHOD FOR CUTTING SEMI/NON-CONDUCTOR USING WEDM
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United States of America Patent
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Issued Date -
May 5, 2016
app pub date -
Jul 7, 2015
filing date -
Nov 5, 2014
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Abstract
A wire electrical discharge machining (WEDM) method is disclosed, the WEDM method comprising steps of: (a) providing one of a non-conductive and a weakly conductive object having a to-be-cut surface; (b) providing one of a wire and a cutting tool having a cutting blade edge to cut the object along the to-be-cut surface; (c) providing a conductive medium to adhere to the to-be-cut surface via the cutting blade edge; and (d) applying an electric current between the one of the wire and the cutting tool, and the to-be-cut surface adhered to the conductive medium such that the to-be-cut surface is melted.
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