Importance

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Abstract

Provided is a composition for metal bonding, especially a bonding composition containing metal particles, which is capable of achieving high bonding strength by bonding at a relatively low temperature without the application of a pressure, and which has heat resistance and is thus not susceptible to decrease in the bonding strength due to decomposition or deterioration of a resin component when the service temperature thereof is increased. A bonding composition which is characterized by containing two or more kinds of metal particles having different average particle diameters, an organic component and a dispersant, and which is also characterized in that the particle diameter ratio of the average particle diameter (DS) of metal particles (S) that have the smallest average particle diameter to the average particle diameter (DL) of metal particles (L) that have the largest average particle diameter, namely DS/DL is from 1×10-4 to 0.5.

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First Claim