Low-E Panels and Methods of Forming the Same
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United States of America Patent
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Issued Date -
May 5, 2016
app pub date -
Nov 3, 2014
filing date -
Nov 3, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Embodiments provided herein describe low-e panels and methods for forming low-e panels. A transparent substrate is provided. A first dielectric layer is formed above the transparent substrate. The first dielectric layer includes zinc, tin, and aluminum. A first reflective layer is formed above the first dielectric layer. A second dielectric layer is formed above the first reflective layer. The second dielectric layer includes zinc, tin, and aluminum. A second reflective layer is formed above the second dielectric layer.
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