RESIN COMPOSITION FOR THERMALLY CONDUCTIVE SHEET, BASE MATERIAL-ATTACHED RESIN LAYER, THERMALLY CONDUCTIVE SHEET, AND SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
May 5, 2016
app pub date -
Nov 4, 2015
filing date -
Nov 5, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A resin composition for a thermally conductive sheet includes a thermosetting resin and a filler dispersed in the thermosetting resin. The filler includes secondary agglomerated particles satisfying the following conditions: a void is formed in the central portion; a communicating pore which begins from the void and communicates with the outer surface of the secondary agglomerated particle is formed; and the ratio of the average pore diameter of the communicating pores to the average void diameter of the voids is equal to or more than 0.05 and equal to or less than 1.0.
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