THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE MADE THEREFROM, AND METHOD OF PREPARING THE THERMOPLASTIC RESIN COMPOSITION

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United States of America Patent

APP PUB NO 20160122532A1
SERIAL NO

14933926

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Abstract

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A thermoplastic resin composition, a molded article made therefrom, and a method of preparing the thermoplastic resin composition are provided. The thermoplastic resin composition includes: a first thermoplastic polymer; and an organic-inorganic composite including a carbonaceous core and a second thermoplastic polymer grafted onto the carbonaceous core, wherein a structural unit of the first thermoplastic polymer and a structural unit of the second thermoplastic polymer are stereoisomers or have different structures.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI GYEONGGI-DO 16677
SEOUL NATIONAL UNIVERSITY R&DB FOUNDATIONSEOUL 08826

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, Kwangmyung Seongnam-si, KR 42 113
Kim, Chansu Seoul, KR 17 13
Lee, Jongchan Seoul, KR 41 49
Lim, Minyoung Daejeon, KR 14 2
Park, Namsoo Suwon-si, KR 31 2283

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