SEMICONDUCTOR DEVICE PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
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United States of America Patent
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Issued Date -
May 5, 2016
app pub date -
Mar 2, 2015
filing date -
Oct 30, 2014
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Abstract
A semiconductor device package includes a substrate having a first surface and a second surface that is opposite to the first surface, a plurality of solder joints disposed on the first surface of the substrate, a semiconductor chip disposed above the second surface of the substrate, and a support member disposed between the second surface of the substrate and the semiconductor chip. At least one of the solder joints is in contact with the first surface of the substrate opposite to a region on the second surface in which the support member is not disposed.
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