Bonding method of semiconductor chip and bonding apparatus of semiconductor chip
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United States of America Patent
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Aug 8, 2017
Issued Date -
N/A
app pub date -
May 12, 2015
filing date -
Oct 30, 2014
priority date (Note) -
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Abstract
According to one embodiment, there is provided a bonding method of a semiconductor chip. The bonding method includes arranging an activated front surface of a semiconductor chip and an activated front surface of a substrate so as to face each other with a back surface of the semiconductor chip attached to a sheet. The bonding method includes pushing the back surface of the semiconductor chip through the sheet to closely attach the activated front surface of the semiconductor chip and the activated front surface of the substrate. The bonding method includes stripping the sheet from the back surface of the semiconductor chip while maintaining a state in which the activated front surface of the semiconductor chip is closely attached to the activated front surface of the substrate.
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