Packaged device including cavity package with elastic layer within molding compound

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United States of America Patent

PATENT NO 9680445
SERIAL NO

14529394

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Abstract

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A device includes a substrate; a cavity package having a first surface attached to the substrate, the cavity package enclosing an electronic circuit; an elastic layer formed on a second surface of the cavity package, opposite the first surface; and a molding compound formed on the substrate, encasing the cavity package and the elastic layer. The elastic layer decouples stress between the cavity package and the molding compound encasing the cavity package, for maintaining structural integrity of the cavity package and for preventing separation of the cavity package from the substrate.

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Patent Owner(s)

  • AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Barfknecht, Andrew Thomas Menlo Park, US 3 32
Oppermann, Klaus-Guenter Holzkirchen, DE 22 392

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