ELECTROPLATING SOLUTION FOR TIN OR TIN ALLOY, AND USE FOR SAME
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United States of America Patent
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Issued Date -
May 12, 2016
app pub date -
May 8, 2014
filing date -
Jun 26, 2013
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Abstract
An object of the present invention is to solve a problem in filling of a blind via or a through-hole with a conventionally used plating solution for tin or tin alloy plating where the filling itself cannot be achieved well, or even if the filling itself could be achieved, it takes an extremely long time. The electroplating solution for tin or tin alloy capable of solving the problem includes the following components (a) and (b):
- (a) a carboxyl group-containing compound, and(b) a carbonyl group-containing compound,a content of the component (a) being 1.3 g/L or more, and a content of the component (b) being 0.3 g/L or more.
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