ETCH ENHANCEMENT VIA CONTROLLED INTRODUCTION OF CHAMBER CONTAMINANTS
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United States of America Patent
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Issued Date -
May 12, 2016
app pub date -
Nov 7, 2014
filing date -
Nov 7, 2014
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Abstract
Embodiments of methods for removing materials from a substrate are provided herein. In some embodiments, a method of controlling contaminants in a process chamber may include flowing a first gas into the process chamber during an interval between completion of a process and start of a subsequent process in the process chamber to remove the contaminants from the process chamber; and flowing a second gas into the process chamber at a specific flow rate during the subsequent process to generate a same species as the contaminants.
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