MULTI-LAYER LASER DEBONDING STRUCTURE WITH TUNABLE ABSORPTION
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United States of America Patent
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app pub date -
Sep 3, 2015
filing date -
Nov 7, 2014
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Abandoned
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Abstract
The absorption properties of both an adhesive layer and an ablation layer are employed to facilitate debonding of a device wafer and a glass handler without damaging the device wafer. The penetration depths of the adhesive and ablation layers are selected such that no more than a negligible amount of the ablation fluence reaches the surface of the device wafer.
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