Ball grid array and land grid array assemblies fabricated using temporary resist
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United States of America Patent
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Apr 2, 2019
Grant Date -
May 12, 2016
app pub date -
Jan 18, 2016
filing date -
Aug 4, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
Ball grid assembly (BGA) bumping solder is formed on the back side of a laminate panel within a patterned temporary resist. Processes such as singulation and flip chip module assembly are conducted following BGA bumping with the temporary resist in place. The resist is removed from the back side of the singulated laminate panel prior to card assembly. Stand-off elements having relatively high melting points can be incorporated on the BGA side of the laminate panel to ensure a minimum assembly solder collapse height. Alignment assemblies are formed on the socket-facing side of an LGA module using elements having relatively high melting points and injected solder.
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