SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

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United States of America Patent

APP PUB NO 20160133559A1
SERIAL NO

14537913

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor structure includes a substrate comprising a plurality of layers formed thereon, at least a first device formed in one of the layers formed thereon, a drawn region enclosing the first device, and a plurality of dummy structures in another layer. The dummy structures are formed in a first region correspondingly outside of the drawing region and in a second region correspondingly inside of the drawing region.

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Patent Owner(s)

Patent OwnerAddress
UNITED MICROELECTRONICS CORPNO 3 LI-HSIN ROAD 2 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU CITY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chun-Nien Tainan City, TW 1 0
Huang, Chin-Chun Tai-Chung City, TW 27 125
Lu, Jui-Fa Tainan City, TW 3 3

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