Microstructure of metal interconnect layer

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United States of America Patent

PATENT NO 10170425
APP PUB NO 20160133573A1
SERIAL NO

14538978

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Abstract

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A metal interconnect layer, a method of forming the metal interconnect layer, a method of forming a device that includes the metal interconnect layer are described. The method of forming the metal interconnect layer includes forming an opening in a dielectric layer, forming a metal layer in the opening and over a top surface of the dielectric layer. The method also includes disposing a metal passivation layer on an overburden portion of the metal layer formed over the top surface of the dielectric layer. The metal passivation layer includes a metal selected from a group of: cobalt (Co), ruthenium (Ru), tantalum (Ta), titanium (Ti), nickel (Ni), tungsten (W), any alloy thereof, nitrides of Co, Ru, Ti, Ni, or W, and any combination thereof. The method also includes performing an anneal at a temperature exceeding 100 degrees centigrade and below 300 degrees centigrade.

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Patent Owner(s)

  • IBM CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
He, Hong Schenectady, US 1180 7763
Li, Juntao Cohoes, US 578 3153
Wang, Junli Singerlands, US 492 2776
Yang, Chih-Chao Glenmont, US 1031 7530

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