WORKPIECE PROCESSING APPARATUS AND METHOD
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United States of America Patent
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Issued Date -
May 19, 2016
app pub date -
Nov 17, 2015
filing date -
Nov 17, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention is related to a workpiece processing apparatus and method for processing a warping workpiece. The workpiece processing apparatus comprises a base, a carrier and an adjusting device. The carrier comprises a loading surface and a plurality of suction units, wherein each of the plurality of suction units is disposed inside the carrier. The adjusting device comprises an adjusting surface, and at least one adjusting portion is protruded from the adjusting surface. A first surface of the workpiece partially contacts to the loading surface of the carrier. At least one of the adjusting device and the carrier is movably connected to the base. By generating a relative movement between the adjusting device and the carrier, the first surface contacts the loading surface in a more even condition so as to make the workpiece become an adjusted workpiece.
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