Polishing Composition and Polishing Method

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United States of America Patent

SERIAL NO

15004424

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Abstract

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A polishing composition contains a polishing accelerator, a water-soluble polymer including a constitutional unit originating from a polymerizable compound having a guanidine structure such as dicyandiamide, and an oxidant. The water-soluble polymer may be a water-soluble polymer including a constitutional unit originating from dicyandiamide and a constitutional unit originating from formaldehyde, a diamine or a polyamine.

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Patent Owner(s)

Patent OwnerAddress
FUJIMI INCORPORATED1-1 CHIRYO 2-CHOME NISHIBIWAJIMA-CHO KIYOSU-SHI AICHI 452-8502

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HIRANO, Tatsuhiko Kakamigahara-shi, JP 23 224
TAMADA, Shuichi Gifu-shi, JP 13 40
UMEDA, Takahiro Iwakura-shi, JP 30 129

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