WATER JET LASER CUTTING DEVICE AND CUTTING METHOD

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United States of America Patent

SERIAL NO

14801151

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Abstract

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There are provided a water jet laser cutting device and cutting method. The water jet laser cutting device includes an impulsive fluid jet unit and at least one laser beam emitting unit. Each laser beam emitting unit is configured to emit laser toward a cutting line, so as to turn a workpiece at the cutting line into a molten state. The impulsive fluid jet unit is configured to jet an impulsive fluid toward the cutting line in a molten state, so as to cut apart the cutting line in a molten state with an impulsive force of the impulsive fluid, and remove molten scraps at the cutting line.

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Patent Owner(s)

Patent OwnerAddress
BOE TECHNOLOGY GROUP CO LTD100015 NO 10 JIUXIANQIAO ROAD BEIJING CHAOYANG DISTRICT BEIJING CITY BEIJING CITY 100015
HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO LTDNO 2177 TONGLING NORTH ROAD XINZHAN DISTRICT HEFEI CITY ANHUI PROVINCE 230012 HEFEI CITY ANHUI PROVINCE 230012

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
JING, Yangkun Beijing, CN 57 90

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