EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ENCAPSULATED USING THE SAME

United States of America Patent

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Issued Date
May 19, 2016
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Jul 30, 2015
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Nov 17, 2014

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Abstract

Disclosed herein is an epoxy resin composition for encapsulating semiconductor devices, the epoxy resin composition including an epoxy resin, a curing agent, inorganic fillers, and a colorant, the colorant including a hydrate.

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Patent Owner	Address
SAMSUNG SDI CO LTD	YONGIN-SI

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C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....

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[Patents Count]

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Inventor Name	Address	# of filed Patents	Total Citations
EOM, Tae Shin	Uiwang-si, KR	5	5
IM, Su Mi	Uiwang-si, KR	9	48
LEE, Eun Jung	Uiwang-si, KR	178	412
YANG, Seung Yong	Uiwang-si, KR	43	769

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EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ENCAPSULATED USING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

14814271

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14814271

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