METHOD FOR FABRICATION OF ANISOTROPIC CONDUCTIVE MEMBER AND METHOD FOR FABRICATION OF ANISOTROPIC CONDUCTIVE BONDING PACKAGE

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United States of America Patent

SERIAL NO

15003154

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Abstract

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Provided is a method for fabrication of an anisotropic conductive member, the method including a residual stress relaxation step of obtaining an anisotropic conductive member that has been subjected to a treatment for relaxing residual stress, after fabricating an anisotropic conductive member having plural conductive paths, in which plural micropores of an insulating matrix formed from an anodic oxide film are filled with a conductive member.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATION26-30 NISHIAZABU 2-CHOME MINATO-KU TOKYO 106-8620

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KOZAWA, Yusuke Shizuoka, JP 3 1

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