SUBSTRATE-LESS ELECTRONIC COMPONENT AND THE METHOD TO FABRICATE THEREOF
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United States of America Patent
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Nov 13, 2015
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Nov 14, 2014
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Abstract
An electronic component is disclosed, the electronic component comprising: a conductive structure, comprising a plurality of conductive layers separated by a plurality of insulating layers, wherein the plurality of conductive layers and the plurality of insulating layers are stacked in a vertical direction, wherein the plurality of conductive layers forms at least one coil, wherein each of the coil is formed along the vertical direction across said plurality of conductive layers, wherein the plurality of insulating layers are not supported by a substrate.
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