Heat removal from photonic devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9397471
APP PUB NO 20160141831A1
SERIAL NO

14541367

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Embodiments of the present description relate to mechanisms for transferring heat through a microelectronic substrate from a photonic device to a heat dissipation device. In one embodiment, the microelectronic substrate may comprise a highly thermally conductive dielectric material. In another embodiment, the microelectronic substrate may comprise a conductive insert within the microelectronic substrate wherein the photonic device is in thermal contact with the conductive insert proximate one surface of the microelectronic substrate and the heat dissipation device is thermal contact with the conductive insert proximate an opposing surface of the microelectronic substrate. In still another embodiment, a stepped heat spreader, having a base portion and a pedestal portion, has the pedestal portion inserted through the microelectronic substrate, wherein the photonic device is in thermal contact with the pedestal portion proximate one surface of the microelectronic substrate and the heat dissipation device is thermal contact with the base portion.

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Patent Owner(s)

  • INTEL CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Li, Zhihua San Jose, US 49 156
Tan, Qing Santa Clara, US 75 1111
Yu, Qinrong San Jose, US 4 9

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