HIGH IMPACT SOLDER TOUGHNESS ALLOY

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

14980146

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Abstract

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A lead-free solder alloy comprising 35-59 wt % Bi, Mn in a concentration up to 1.0 wt %, Cu in a concentration of up to 1 wt %, and balance Sn, together with any unavoidable impurities. Some embodiments also contain up to about 1 wt % Ag.

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Patent Owner(s)

Patent OwnerAddress
ALPHA METALS INCWATERBURY CONN WATERBURY CONNECTICUT

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chattopadhyay, Kamanio Bangalore, IN 11 18
Chegudi, Sujatha Bangalore, IN 8 10
de, Avila Ribas Morgana Bangalore, IN 20 56
Kumar, Anil KN Bangalore, IN 5 10
Lodge, Dominic Woking, GB 9 17
Pandher, Ranjit Plainsboro, US 40 143
Sarkar, Siuli Bangalore, IN 53 164
Singh, Bawa Marlton, US 108 1502

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