PROTECTION FILM AND METHOD FOR DEPOSITING THE SAME
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United States of America Patent
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Issued Date -
May 26, 2016
app pub date -
Dec 26, 2014
filing date -
Nov 26, 2014
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Abstract
A protection film and a method for depositing the protection film are provided. The method is used to form a protection film having low resistivity on a substrate. In the method, at first, a mixing operation is performed to mix a plurality of metal gases. The metal gases consist of silver, magnesium, and aluminum, or consist of silver, copper, and aluminum, or consist of copper, Nickel, and aluminum. The metal gases have two or more atom sizes. Thereafter, a depositing operation is performed to deposit an amorphous metal film on the substrate by using the mixed metal gases. The atoms of the amorphous metal film are arranged in a short-range order. Then an annealing treatment is performed to anneal the amorphous metal film to form a meta-stable metal film having averagely distributed grains to be used as the protection film.
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