PATTERN FORMATION METHOD, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

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United States of America Patent

SERIAL NO

15011870

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Abstract

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The pattern formation method includes the following steps (i) to (iii): (i) a step in which an active-light-sensitive or radiation-sensitive resin composition is used to form a film whose solubility in a developer increases as the exposure dose increases from an unexposed state but then decreases once a predetermined exposure dose has been reached; (ii) a step in which the film is exposed; and (iii) a step in which a developer containing an organic solvent in the amount of 80% by mass or more with respect to the total amount of the developer is used to develop the exposed film.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATIONTOKYO 106-8620

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
YOSHINO, Fumihiro Haibara-gun, JP 31 54

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