Communication Module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
May 26, 2016
app pub date -
Oct 28, 2015
filing date -
Nov 20, 2014
priority date (Note) -
Published
status (Latency Note)
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Abstract
A communication module is mounted on a mother board provided in an electronic device and is thermally connected to a heat sink provided on the mother board. The communication module includes: a housing having a heat-dissipating surface thermally connected to a heat-absorbing surface of the heat sink; an elastic piece that presses the housing to the heat-absorbing surface; a module substrate accommodated in the housing; a plug connector protruding from the housing and inserted into and removed from a receptacle connector on the mother board; and a support member that supports the module substrate inside the housing. The module substrate is not in contact with the housing and is swingably supported with the support member as a support point.
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