PHOTORESIST REMOVAL
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United States of America Patent
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Issued Date -
Jun 2, 2016
app pub date -
Feb 8, 2016
filing date -
Dec 20, 2002
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Abstract
Disclosed herein is a composition and method for semiconductor processing. In one embodiment, a wet-cleaning composition for removal of photoresist is provided. The composition comprises a strong base; an oxidant; and a polar solvent. In another embodiment, a method for removing photoresist is provided. The method comprises the steps of applying a wet-cleaning composition comprising about 0.1 to about 30 weight percent strong base; about one to about 30 weight percent oxidant; about 20 to about 95 weight percent polar solvent; and removing the photoresist.
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