STRESS ISOLATED MEMS DEVICE WITH ASIC AS CAP
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United States of America Patent
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Issued Date -
Jun 9, 2016
app pub date -
Dec 9, 2014
filing date -
Dec 9, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A package includes a MEMS die and an integrated circuit (IC) die coupled to and stacked with the MEMS die. The MEMS die includes a substrate having a recess formed therein. A cantilevered platform structure of the MEMS die has a platform and an arm suspended over the recess, where the arm is fixed to the substrate. A MEMS device resides on the platform. The IC die is coupled to the MEMS die to serve as a protective cap for MEMS device. The MEMS die may be a pressure sensor die, and the MEMS device residing on the platform may be a sensor diaphragm. Thus, the IC die can include access vents extending through it for passage of a fluid from an external environment so that the sensor diaphragm can detect the pressure of the fluid.
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