Wireless probes

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United States of America Patent

PATENT NO 10018670
SERIAL NO

14963076

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is a probe card for testing a wireless module on an integrated circuit die contained on a wafer. The probe card includes a connector and a plurality of probes. The connector connects the probe card to test equipment. The plurality of probes connects the probe card to a wafer containing a plurality of integrated circuit dies. The probe card additionally includes an antenna configured to transmit a wireless test signal to be received by at least one of the integrated circuit dies, and/or to receive a wireless signal transmitted by at least one of the integrated circuit dies.

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Patent Owner(s)

  • ESILICON CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DeLaCruz, Javier Summit, US 29 775

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