Elongated pad structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10050003
APP PUB NO 20160163669A1
SERIAL NO

14963081

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Importance

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Abstract

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A 3DIC includes a die and a substrate. The die includes multiple bumps to provide electrical connection the substrate. The substrate includes multiple elongated contact pads. The elongated contact pads making electrical contact with the bumps and shaped to maintain alignment with the bumps over a temperature range.

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Patent Owner(s)

  • ESILICON CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DeLaCruz, Javier Summit, US 29 779

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