Wireless System Package and Communication Method of Wireless System Package and Communication Device
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United States of America Patent
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Nov 19, 2015
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Dec 8, 2014
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Abstract
A wireless system package includes a substrate, an external non-volatile memory, a first integrated circuit, and a second integrated circuit. The first integrated circuit includes a System on Chip unit, a bus, a first clock unit, a first terminal, a second terminal, and a third terminal. The second integrated circuit includes a second heterogeneous communication module, a second clock unit, a first terminal, and a second terminal. The first integrated circuit or the second integrated circuit includes a first heterogeneous communication module for providing and processing a first wireless signal. A capacity of the external non-volatile memory is larger than a capacity of the internal non-volatile memory.
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