PLASMA ABATEMENT USING WATER VAPOR IN CONJUNCTION WITH HYDROGEN OR HYDROGEN CONTAINING GASES
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United States of America Patent
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Issued Date -
Jun 16, 2016
app pub date -
Nov 17, 2015
filing date -
Dec 16, 2014
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Abstract
A plasma abatement process for abating effluent containing a PFC gas from a processing chamber is described. A plasma abatement process takes gaseous foreline effluent from a processing chamber, such as an etch chamber, and reacts with the effluent within a plasma chamber placed in the foreline path. The plasma dissociates the PFC gases and reacts them with a reagent, converting the effluent into compounds that are non-global warming and which may be easily removed by traditional facility water scrubbing technology. This disclosure explains methods to control the reagent hydrogen to oxygen ratio such that in addition to PFC destruction, the abated compounds have modified composition to enable extension of the maintenance interval for downstream supporting equipment.
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