POWER HEAT DISSIPATION DEVICE AND METHOD FOR CONTROLLING THE SAME
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United States of America Patent
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Jun 16, 2016
app pub date -
Oct 21, 2015
filing date -
Dec 10, 2014
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Abstract
A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one thermoelectric cooling chip. The heat-conducting layer has a heat-absorbing-surface and a heat-dissipating-surface which are opposite to each other. The heat sink is in thermal contact with the heat-dissipating-surface of the heat-conducting layer. The at least one thermoelectric cooling chip is embedded in the heat-conducting layer. The heat-conducting layer has an effective heat-conducting-region. A1 is the area on the heat-absorbing-surface which the effective heat-conducting-region projects on, and A2 is the area on the heat-absorbing-surface which the thermoelectric cooling chip projects on. The ratio of A2 to A1 is between 0.15 and 0.58.
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