Thermal interface material system

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United States of America Patent

PATENT NO 11060805
APP PUB NO 20160169598A1
SERIAL NO

14967087

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Abstract

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A thermal interface material system includes a thermally conductive porous matrix, the thermally conductive porous matrix having a plurality of interstitial voids, and a thermally conductive colloidal suspension disposed on each side of the thermally conductive porous matrix to inhibit thermal pump-out of the thermally conductive colloidal suspension so that the thermally conductive porous matrix and thermally conductive colloidal suspension collectively form a thermally conductive porous pad.

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Patent Owner(s)

  • TELEDYNE SCIENTIFIC & IMAGING, LLC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bhunia, Avijit Newbury Park, US 17 125
Gould, Kyle D Los Angeles, US 5 20
Semenic, Tadej Thousand Oaks, US 10 139

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