Stiffener tape for electronic assembly
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United States of America Patent
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Oct 17, 2017
Issued Date -
Jun 16, 2016
app pub date -
Dec 12, 2014
filing date -
Dec 12, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Some example forms relate to a stiffener tape for a wafer. The stiffener tape includes a mounting tape and a stiffener removably attached to the mounting tape. The stiffener tape further includes a die attach film attached to the stiffener. Other example forms relate to an electronic assembly that includes a wafer and a stiffener tape attached to the wafer. The stiffener tape includes a die attach film mounted to the wafer. A stiffener is attached to the die attach film and a mounting tape is removably attached to the stiffener. Still other example forms relate to a method that includes forming a stiffener tape which includes a mounting tape, a stiffener removably attached to the mounting tape and a die attach film attached to the stiffener.
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