Bonding clip, carrier and method of manufacturing a bonding clip
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United States of America Patent
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Issued Date -
Jun 16, 2016
app pub date -
Dec 12, 2015
filing date -
Dec 15, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
Various embodiments provide a clip for clip bonding of a die to a carrier (bonding clip), wherein the clip comprises a clip body comprising a first region configured to be fixed on a carrier and a second region configured to be fixed to a die, wherein at least one of the first region and the second region comprises a guiding structure configured to guide the clip when connecting the carrier and the die.
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