Magnetic intermetallic compound interconnect

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United States of America Patent

PATENT NO 9847308
SERIAL NO

14566185

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Abstract

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The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mahajan, Ravindranath V Chandler, US 71 727
Swaminathan, Rajasekaran Tempe, US 53 396

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