SEMICONDUCTOR DEVICE AND SOLID-STATE IMAGING DEVICE
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United States of America Patent
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Issued Date -
Jun 16, 2016
app pub date -
Dec 3, 2015
filing date -
Dec 10, 2014
priority date (Note) -
Abandoned
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Abstract
Certain embodiments provide a semiconductor device including a semiconductor substrate having an element portion, an insulating film provided on a main surface of the semiconductor substrate, at least one wire provided on the insulating film and electrically connected to the element portion, an uneven portion provided on the main surface side of the semiconductor substrate, and a protection film provided in contact with the wire and the uneven portion, and also in contact with the insulating film.
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