WIRING BOARD WITH DUAL WIRING STRUCTURES INTEGRATED TOGETHER AND METHOD OF MAKING THE SAME
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United States of America Patent
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app pub date -
Jun 22, 2015
filing date -
Dec 15, 2014
priority date (Note) -
Abandoned
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Abstract
A wiring board with integrated dual wiring structures is characterized in that first and second wiring structures are positioned within and beyond a through opening of a stiffener, respectively. The mechanical robustness of the stiffener can prevent the wiring board from warping. The first wiring structure, positioned within the through opening of the stiffener, can provide primary fan-out routing, whereas the second wiring structure not only provides further fan-out wiring structure for the first wiring structure, but also mechanically binds the first wiring structure with the stiffener.
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