Cable for alternative interconnect attachement

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United States of America Patent

PATENT NO 9924595
SERIAL NO

14567402

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Importance

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Abstract

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In one embodiment, the apparatus comprises: a substrate having a first side and a second side, the second side being on an opposite side of the substrate from the first side, where the substrate has a first location on the first side at which an semiconductor package is to be coupled; and a cable coupled to the substrate on the second side of the substrate at a second location on the second side, the second location being at least partially below the first location.

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Patent Owner(s)

  • INTEL CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Beom-Taek Mountain View, US 27 72
Shibayama, Raul Enriquez Zapopan, MX 1 2

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