COOLING FOR COMPONENTS OF ELECTRONIC DEVICES
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 16, 2016
app pub date -
Dec 16, 2014
filing date -
Dec 16, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device upon occurrence of a heat condition are disclosed herein. In embodiments, one or more piezo louvers, or some other cooling zone director, may be used to direct a fan from cooling a first one of the heat-generating components to cooling another one of the heat-generating components. Other embodiments may be described and/or claimed.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully