Method of manufacturing a UV curable CMP polishing pad
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United States of America Patent
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Oct 2, 2018
Grant Date -
Jun 23, 2016
app pub date -
Dec 18, 2014
filing date -
Dec 18, 2014
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Abstract
A method of fabricating a chemical mechanical polishing pad includes introducing polymer precursors containing acrylate functional groups into a mold, providing abrasive particles and a photo-initiator in the polymer precursors to form a mixture, and while the mixture is contained between a bottom plate and a top cover of the mold, exposing the mixture to ultraviolet radiation through a transparent section of the mold to cause the polymer precursors to form radicals, forming a polymer matrix from the polymer precursor by causing the radicals to cross-link with one another. The polishing layer includes the polymer matrix having the abrasive particles dispersed therein.
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