Controlled-viscosity CMP casting method

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United States of America Patent

PATENT NO 9452507
SERIAL NO

14576896

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Abstract

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The invention provides a method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The method obtains a liquid polyurethane material formed from an isocyanate-terminated molecule and a curative agent. The liquid polyurethane material contains 4.2 to 7.5 weight percent fluid-filled polymeric microspheres in the isocyanate-terminated molecule. The fluid-filled polymeric microspheres are a blend of preexpanded and unexpanded fluid-filled polymeric microspheres. The liquid polyurethane material contains a blend of preexpanded and unexpanded fluid-filled polymeric microspheres having a relative viscosity

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Patent Owner(s)

Patent OwnerAddress
DDP SPECIALTY ELECTRONIC MATERIALS US INC1501 LARKIN CENTER DRIVE MIDLAND MI 48642

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jacob, George C Newark, US 34 105
Qian, Bainian Newark, US 54 363

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