Apparatus and method to provide a thermal parameter report for a multi-chip package

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United States of America Patent

PATENT NO 10877530
APP PUB NO 20160179158A1
SERIAL NO

14852859

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Abstract

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In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BLVD SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ahuja, Sandeep University Place, US 48 387
Berktold, Michael Phoenix, US 5 19
Chin, Howard Westford, US 25 104
Kam, Timothy Y Portland, US 5 58
Kandula, Phani Kumar Bangalore, IN 16 71
Sistla, Krishnakanth V Beaverton, US 96 795
Steinbrecher, Robin A Olympia, US 15 185
Thomas, Tessil Bangalore, IN 58 1074

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