PACKAGED SEMICONDUCTOR DEVICE HAVING ATTACHED CHIPS OVERHANGING THE ASSEMBLY PAD
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United States of America Patent
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app pub date -
Dec 23, 2014
filing date -
Dec 23, 2014
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Abstract
A semiconductor device (200) comprising a semiconductor chip (201) has an electrically active side (201a) and an opposite electrically inactive side (201b); the active side bordered by an edge having a first length (202a), and the inactive side bordered by a parallel edge having a second length (202b) smaller than the first length; a substrate has an assembly pad (210) bordered by a linear edge having a third length (210a) equal to or smaller than the first length; the inactive chip side attached to the pad so that the edge of the first length is parallel to the edge of the third length; the active side of the attached chip forms an overhang over the pad, when the third length is smaller than the first length.
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