Method of making an electromagnetic interference shield for semiconductor chip packages

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United States of America Patent

PATENT NO 9691711
SERIAL NO

15055120

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electromagnetic interference shield is described for semiconductor chip packages. In some embodiments, a mold compound is formed over a semiconductor die, the die being over a front side redistribution layer on a side opposite the mold compound, the redistribution layer extending past the die and the mold compound extending around the die to contact the redistribution layer. A plurality of vias are formed in the mold compound vertically toward the redistribution layer, the vias being outside of the die, wherein the bottoms of the vias are over a ground layer of the front side redistribution layer. A continuous conductive shielding film is applied over the mold compound and into the vias, wherein the shielding film in some of the vias directly connects to the ground layer and wherein the shielding film in some of the vias does not directly connect to the ground layer, the redistribution layer connecting the metal film to an external ground so that the vias form a shield.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Deshpande, Nitin Ashok Chandler, US 2 269
Elsherbini, Adel A Chandler, US 256 1524
Guzek, John S Chandler, US 89 1661
Mahajan, Ravindranath V Chandler, US 71 727

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