Three-dimensional integrated circuit integration
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United States of America Patent
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Dec 6, 2016
Issued Date -
N/A
app pub date -
Dec 19, 2014
filing date -
Dec 19, 2014
priority date (Note) -
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Abstract
Wiring structures, methods for providing a wiring structure, and methods for distributing currents with a wiring structure from one or more through-substrate vias to multiple bumps. A first current is directed from a first through-substrate via of a first electrical resistance through a first connection line to a first bump and directing a second current from the first through-substrate via through a second connection line of a second electrical resistance to a second bump. The first connection line has a first length relative to a first position of the first bump and a first cross-sectional area, the second connection line has a second length relative to a first position of the second bump and a second cross-sectional area, the second length is different from the first length, and the second cross-sectional area is different from the first cross-sectional area.
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