Semiconductor Device and Method for Manufacturing a Semiconductor Device

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United States of America Patent

APP PUB NO 20160181441A1
SERIAL NO

14971823

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device includes a semiconductor material having a bandgap larger than 2 eV and less than 10 eV, and a contact layer in contact with the semiconductor material. The contact layer includes a metal nitride. A non-ohmic contact is formed between the semiconductor material and the contact layer.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AUSTRIA AGVILLACH

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kern, Ronny Finkenstein, AT 22 15
Konrath, Jens Peter Villach, AT 53 103
Krivec, Stefan Arnoldstein, AT 22 49
Schmid, Ulrich Wien, AT 44 209
Stoeber, Laura Wien, AT 5 5

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