CPU package substrates with removable memory mechanical interfaces

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United States of America Patent

PATENT NO 9832876
SERIAL NO

14575775

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Abstract

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Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.

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Patent Owner(s)

  • INTEL CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Coury, Bassam N Dupont, US 24 376
Ganesan, Sanka Chandler, US 79 481
Holden, Thomas T Olympia, US 5 57
Li, Xiang Portland, US 1390 10752
Liu, Kuang C Queen Creek, US 11 32
Llapitan, David J Tacoma, US 22 258
Lynch, John M Forest Grove, US 14 76
Murtagian, Gregorio R Phoenix, US 19 60
Prakash, Mani University Place, US 44 2642
Smalley, Jeffory L East Olympia, US 55 177
Swaminathan, Rajasekaran Tempe, US 53 396
Thibado, Jonathan W Beaverton, US 17 51
Vergis, George Portland, US 136 880
Viswanath, Ram S Phoenix, US 30 380
Zhang, Zhichao Chandler, US 133 560
Zhao, Chong J West Linn, US 13 41
Ziakas, Dimitrios Hillsboro, US 34 456

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