Electronic Component and Overmolding Process
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 23, 2016
app pub date -
Dec 23, 2014
filing date -
Dec 23, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Electronic components and overmolding processes are disclosed. The electronic component, such as, an antenna, includes a substrate, an overmolding bonded to at least a portion of the substrate, the overmolding being a non-planar arrangement of a polymeric material, and a conductive ink positioned on the substrate between the substrate and the overmolding. The conductive ink is devoid or substantially devoid of delamination or fracture from the bonding of the overmolding to the substrate. The overmolding process includes providing a substrate, applying a conductive ink onto the substrate, and bonding an overmolding to at least a portion of the substrate, the overmolding being an arrangement of a polymeric material. The conductive ink is devoid or substantially devoid of delamination or fracture through the bonding of the overmolding to the substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully